Iceotope Chassis-level Liquid Cooling for More Reliable, Available and Secure Edge Service Delivery
Edge Computing Innovation of the Year
Entry Description
Iceotope Technologies Limited is a UK based technology business supplying a patented cooling platform for the IT industry.
Iceotope chassis-level liquid cooling technologies address number of key requirements for edge computing applications, from the requirement to accommodate high density loads - to date Iceotope has shown it can cool 3.2kW per 1u / 100kW per rack – at the same time addressing security, noise and power supply concerns (the solutions do not require a 3-phase utility connection).
The new technology provides the following benefits in edge installations:
• Efficient: No need for air conditioning, delivers same processing power with less energy
• Silent: No industrial drone from fans and pumps
• Resilient: All components are in a sealed module that resists dust and smoke
• Compact: Smaller, more flexible footprint
Iceotope’s technologies are manufactured in Sheffield, and have been deployed in the UK, North America and Asia. Chassis-level liquid cooling technology by Iceotope provides data centre operators with the means to design and operate capital and energy efficient sustainable facilities, with lower operating costs. The technology requires less infrastructure and less power than conventional approaches for removing heat from the data centre, at the same time maximizing the use of valuable technical space.
Engineered to fit all standard form factors including retrofit installations, it provides end users with new levels of flexibility for IT deployments within technical white space and in new Edge environments where traditional cooling is unsuitable. Iceotope chassis-level liquid cooling is a key technology enabler for next-generation edge of network installations, data centres and ICT applications.
Iceotope chassis-level liquid cooling solutions have been developed with partners including Schneider Electric and are available through Avnet.

Iceotope chassis-level liquid cooling at the edge
In new Edge environments where IT services need to be located close to people and things, immersion cooling is the ideal solution due to its ease of deployment and greatly reduced maintenance needs.
Iceotope’s cooling technologies remove the need for and the restrictions created by energy-intensive ai cooling systems - including the server fans – allowing the 15 – 16% of site power which is normally stranded to be reclaimed while using up to 5 times less energy.
The new liquid cooling technology addresses concerns about a loss of efficiency as IT is moved into edge locations. Operating at a PUE of 1.03, Iceotope’s chassis-level liquid cooling technologies complies with all existing guidance, falling far below the lowest regulated PUE of 1.3.
An additional environmental benefit of having no fans and air-cooling infrastructure mean Iceotope’s technologies operate in pure silence. While fans and moving parts are critical for cooling electronics with air, they also represent failure points which need regular servicing and maintenance. This is not desirable for edge applications where this could add significantly to the cost of IT service delivery, as well as creating challenges for reliability and customer satisfaction.
Ideal for installation outside of the controlled environments found in today’s data centres, Iceotope’s chassis-level immersion cooling technologies are 100% sealed and resilient, isolating IT devices from the external environment and thereby protecting it from airborne contaminants. With no air being pushed around it makes for cleaner, safer white space.
Enabling compute to be deployed to the Edge in a sealed and safe environment which is impervious to heat, dust and humidity, also makes it resistant to prying fingers and endows it with a high degree of “human error resilience.”
Iceotope's technologies are enabling data processing, storage and networking to be located in places which until now have not been possible.

Iceotope’s Key Distinguishing Features:
Unique features of Iceotope technology include its patented cooling retaining heatsinks for super- efficient cooling of the hottest part of IT electronics. Its chassis-level liquid cooling solutions are engineered to cool the entire IT stack in every use case.
Iceotope’s liquid cooling works through the use of two pumped circuits, de-coupled by a plate heat exchanger. The first circuit consists of a dielectric coolant that immerses and harvests heat from every component on the heat-generating electronics and circulates continuously within a sealed chassis.
The dielectric coolant (around 2kg per kW) is precision delivered to Iceotope’s patented heat sinks and then overflows into the chassis to capture heat from every component. The cooled fluid is delivered to the coolant retaining heatsinks on the hottest part of the electronics via a manifold and the cycle repeats.
Immersed micro pumps create a gentle recirculating coolant flow inside the chassis enabling the heat to be transferred to a building circuit via a plate heat exchanger.
The coolant enters the heat exchanger at up to 45oC and exits at up to 50oC.
The high operating temperatures give operators the option to remove chillers from the data centre as heat can be rejected to ambient using dry-coolers; or captured and reused for heating.

Iceotope’s tangible benefits for markets and customers:
Iceotope removes complexity from edge IT environment layouts and operations, ensuring more space can be dedicated to serving IT workloads. Because IT equipment can be operated without the need for fans Iceotope’s technology brings game-changing reductions in energy and water consumption.
Immersion liquid cooling eliminates the need for hot and cold aisles delivering significant cost reductions when designing and implementing IT environments. One of the key benefits of liquid cooling is the ability to compact the IT equipment and save space – essential considerations in edge locations. Iceotope’s chassis-level immersion cooling technologies reduces the overall physical space requirements by up to 75% for a given IT load.
Schneider Electric’s preliminary Capex analysis of Iceotope’s chassis-level immersive cooling solution versus a traditional air-cooled solution, based on a 2MW data centre revealed a conservative estimate of Capex savings of 14%, and significant Opex savings.
Iceotope’s technologies are engineered to fit all standard form factors – including retrofit, they can also be compacted into smaller custom form factors which specifically address the requirements of the non-IT environments typically found in Edge computing installations.
Supporting Documents